As the trend towards smaller, lighter and thinner luminaires continues to gain momentum, LED manufacturers—including Lumileds—have responded by shrinking the size of their LED packaging. One result of this trend is the growing popularity of Chip Scale Package (CSP) technology. CSP technology eliminates the traditional submount to directly attach the LED die to the PCB, allowing for overall system cost reductions. As fully functional LED packages that are equal to or slightly larger than the size of a die, CSPs are increasingly being implemented in lighting designs.
Customers now have complete design flexibility to access Lumileds industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications with the 1.0mm2 LUXEON FlipChip. LUXEON FlipChip is a real Chip Scale Package (CSP) LED that can be attached by reflow without additional packaging. Traditional wire bonding limits the packing and power density of LEDs. LUXEON FlipChip LEDs can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities.
LUXEON FlipChip White enables the next generation of lighting applications. Lumileds industry-leading line of Chip Scale Package (CSP) LEDs gives customers complete design flexibility. LUXEON FlipChip White includes the highest flux-density chip scale package, maximizing beam control and enabling high packing density on a PCB. Its wide viewing angle delivers increased uniformity and potential for system cost reductions in diffuse and omnidirectional lighting applications. In addition, LUXEON FlipChip White is the ideal choice for cost sensitive applications as it can achieve high efficacy and flux at high current density, providing leading lm/$.