LUXEON FlipChip UV is the smallest and highest power density (W/cm2) ultraviolet chip-scale package LED that can be reflowed onto a substrate with a standard surface mount (SMT) equipment and process. LUXEON FlipChip UV LED enables tighter beam control and completely eliminates wire bonds in the system. LUXEON FlipChip UV is the ideal choice for cost sensitive applications to achieve high irradiance at high current density, maximizing W/$ by taking the advantage of lowest thermal resistance.

  • Ultraviolet wavelength range of 380–410nm for a range of options
  • Micro sized CSP: 1.0mm2 package for design flexibility and packing density
  • No wire bonds allows for direct attach and reflow
  • 5-sided emitter with batwing radiation pattern enables wide viewing angles
  • Low thermal resistance for leading system level lm/$
  • Maximum drive current of 1A for delivers superior lumens for reduced LED count



At 1/5th the size of other ultraviolet and violet LEDs, LUXEON Z UV LEDs, a SMT device, can be assembled in tight arrays with spacing of only 200 microns, which enables high power density (W/cm2) system for superior efficiency and design freedom. The product is undomed for precise optical control, and a portfolio covering ultraviolet and violet light. The superior quality of light, volume of lumens, and real world efficacy enable leading performance and efficient solution development in a wide variety of indoor and outdoor lighting segments.

  • Offering ultraviolet in 380-400nm and violet (400-430nm) for a range of options
  • Small 2.2mm² SMT footprint enables highest W/cm2 systems, design flexibility
  • 1A max drive current allows more flux per LED
  • Up to 45%+ efficiency reduces heat output
  • AlN package of as low as 3.5 K/W for better thermal management