LUXEON Thermal Capabilities
A key element in delivering quality high-power LEDs is managing the heat emitted from the LED chip. Advanced packaging technology provides LUXEON® power LEDs with unique thermal management capabilities. Using a thermal heatsink slug for the LED chip, heat is pulled away from the chip and can be transferred to a thermal management system. Because of the unique thermal design features and capabilities, LUXEON® LEDs can withstand the industry’s highest junction temperatures allowing for increased light output performance. For more information about the thermal capabilities of LUXEON® LEDs, please consult our application briefs and datasheets.
Typical construction of a 5mm LED
(little or no thermal management)

Construction of a LUXEON®K2 Power LED
(Thermal Heatsink extracts heat from the LED chip)

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