LUXEON FlipChip Royal Blue

High current density Chip Scale Package (CSP) LED

LUXEON FlipChip Royal Blue

Customers now have complete design flexibility to access Lumileds industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications with two package sizes, 0.5mm2 and 1.0mm2 LUXEON FlipChip Royal Blue. LUXEON FlipChip Royal Blue is a real Chip Scale Package (CSP) LED that can be attached by reflow without additional packaging. Traditional wire bonding limits the packing and power density of LEDs. LUXEON FlipChip Royal Blue LEDs can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities.

Product performance at test current, Tj=25°C.
Size
(mm2)
Dominant Wavelength (nm)Radiometric Power (mW)Test Current
(mA)
Part Number
MinimumMaximumMinimumTypical
0.5 445 450 275 287 175 L0F2-B445050002751
450 455 275 287 175 L0F2-B450050002751
455 460 275 287 175 L0F2-B455050002751
1.0 445 450 550 575 350 L0F2-B445100005501
450 455 550 575 350 L0F2-B450100005501
455 460 550 575 350 L0F2-B455100005501

Documentation

Design Resources

  • Electrical

    Electrical

    LUXEON Flip Chip
    LL ID File Format Title Products Colors/Packages Modified Size (MB)
    DRE1759 Gerber LUXEON FlipChip Royal Blue and LUXEON FlipChip UV Gerber LHDF-RB10-3xxx
    LHDF-RB10-4xxx
    LHDF-RB10-5xxx
    LHDF-RB10-6xxx
    More Products
    07/17/2014 0.33

Features & Benefits

  • Micro sized CSP: 0.5mm2 and1.0mm2 package for design flexibility and packing density
  • No wire bonds allows for SMT direct attach and reflow
  • 5-sided emitter enables wide viewing angle
  • 445–460nm wavelength range for dispense and remote phosphor applications
  • Low thermal resistance of 1.5°K/W (1mm2) for leading system level lm/$

Applications